
P89V52X2_3
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 4 May 2009
51 of 57
NXP Semiconductors
P89V52X2
80C51 with 256 B RAM, 192 B data EEPROM
10. Package outline
Fig 30. Package outline SOT129-1 (DIP40)
UNIT
A
max.
1
2
b1
cD
E
e
MH
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT129-1
99-12-27
03-02-13
A
min.
A
max.
b
Z
max.
w
M E
e 1
1.70
1.14
0.53
0.38
0.36
0.23
52.5
51.5
14.1
13.7
3.60
3.05
0.254
2.54
15.24
15.80
15.24
17.42
15.90
2.25
4.7
0.51
4
0.067
0.045
0.021
0.015
0.014
0.009
2.067
2.028
0.56
0.54
0.14
0.12
0.01
0.1
0.6
0.62
0.60
0.69
0.63
0.089
0.19
0.02
0.16
051G08
MO-015
SC-511-40
MH
c
(e )
1
ME
A
L
seating
plane
A1
w M
b1
e
D
A2
Z
40
1
21
20
b
E
pin 1 index
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
(1)
DIP40: plastic dual in-line package; 40 leads (600 mil)
SOT129-1